MosChip Technologies has announced its collaboration with EMASS on the silicon implementation of EMASS’s ECS-DoT Edge AI System-on-Chip (SoC), an ultra-low-power solution designed for always-on intelligence in wearables, drones, industrial IoT devices and edge sensors.
EMASS, which led the architecture design of the ECS-DoT, has set ambitious performance and energy-efficiency targets for the chip, aiming for up to 93 per cent faster processing and 90 per cent lower energy consumption compared with conventional edge AI solutions.
To support this development, MosChip delivered engineering services for the SoC’s silicon implementation in 22nm technology, including physical design flows, tape-out coordination, packaging, assembly, evaluation hardware and validation activities. The collaboration has resulted in a fully functional SoC and evaluation platform.
Srinivasa Rao Kakumanu, CEO and Managing Director, MosChip Technologies, said, “This collaboration demonstrates the impact of pairing innovative SoC architecture with experienced silicon engineering support. EMASS defined a highly differentiated architecture, and MosChip was pleased to support its silicon implementation through our physical design and product engineering services.”
The ECS-DoT is a compact RISC-V-based Edge AI SoC featuring dual neural accelerators and 4MB of on-chip memory. It enables real-time, milliwatt-class inference for vision, audio and sensor workloads without reliance on cloud connectivity, making it suitable for power- and space-constrained applications such as drones, wearables, healthcare trackers and industrial monitoring systems.
Mark Goranson, CEO, EMASS, noted, “MosChip played an important role in supporting the silicon implementation of our architecture. Their contributions in physical design, product engineering and validation complemented our internal efforts and helped us bring a robust SoC to our OEM partners.”
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